How prepared the EDA community is to address upcoming challenges isn’t clear.
Dennard scaling is gone, Amdahl’s Law is reaching its limit, and Moore’s Law is becoming difficult and expensive to follow, particularly as power and performance benefits diminish. And while none of that has reduced opportunities for much faster, lower-power chips, it has significantly shifted the dynamics for their design and manufacturing.
Rather than just different process nodes and half nodes, companies developing chips — traditional chip companies, automotive OEMs, fabless and non-fabless IDMs, and large systems companies — are now wrestling with more options and more unique challenges as they seek optimal solutions for their specific applications. And they are all demanding more from an EDA ecosystem, which is racing to keep up with these changes, including various types of advanced packaging, chiplets, and a demand for integrated and customized hardware and software….
To read the full Semiconductor Engineering article by Ann Mutschler, click here.