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Heterogenous Integration Creating New IP Opportunities

New packaging technology is spawning new markets for IP, but it is not clear how many interface standards will be created and need to be supported.

Semiconductor Engineering

 

The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is required for various forms of integration…

 

To read the full Semiconductor Engineering article by Brian Bailey, click here.


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