Processing more data in more places while minimizing its movement becomes a requirement and a challenge.
Movement and management of data inside and outside of chips is becoming a central theme for a growing number of electronic systems, and a huge challenge for all of them.
Entirely new architectures and techniques are being developed to reduce the movement of data and to accomplish more per compute cycle, and to speed the transfer of data between various components on a chip and between chips in a package. Alongside of that, new materials are being developed to increase electron mobility and to reduce resistance and capacitance…
To read the full Semiconductor Engineering article by Marie C. Baca, click here.