Realizing the benefits of digital twins is more complicated than translating data between tools.
Semiconductor design, manufacturing, and test are becoming much more tightly integrated as the chip industry seeks to optimize designs using fewer engineers, setting the stage for greater efficiencies and potentially lower chip costs without just relying on economies of scale.
The glue between these various processes is data, and the chip industry is working to weave together various steps throughout these flows by utilizing that data in more places. The goals include better visibility when making tradeoffs in heterogeneous designs, faster time to market, and improved reliability in the field. That will be enabled by in-chip and in-system monitoring capabilities, and bi-directional sharing and utilization of data back and forth across the design-through-manufacturing flow….
To read the full Semiconductor Engineering article by Ann Mutschler, click here.