Comments

With software now a key deliverable in semiconductor products, our customers increasingly need to develop hardware and software in parallel to hit ever-decreasing market windows, and virtual platforms are a key technique in achieving that. Our partnership with Imperas thus allows T&VS to enhance the solutions we can offer to the market. I am particularly excited by the Imperas fault injection capability which is a key verification technique in the growing safety markets such as automotive.

The Imperas virtual platform environment is amazingly easy to use. Starting with the Imperas RH850F1H Extendable Platform Kit, we were able to get eMCOS running in our custom RH850 virtual platform in only 2 weeks.  Also, the simulation performance is even faster than real time. This combination provides our customers with new tools to accelerate software development and improve product quality.

Imperas tools and models provide us with enhanced capabilities to pursue research we could not otherwise achieve with significantly less upfront development effort.  The virtual platforms allow us to rapidly explore state-of-the-art prototypes and bridges the gap between hardware and software development.

We have seen that virtual platform based methodology can accelerate IoT product development. Imperas OVP models combined with the Imperas embedded software tools, supported by Coontec’s experienced staff, is a great solution for the Korean market.

Coontec has seen that Imperas offers the best portfolio of virtual prototyping and simulation solutions in the world. Our partnership allows us to offer customers a comprehensive solution to enable shorter time-to-market and enhanced reliability in software development, debug, and test. Imperas will bring greater security and speed to our customers' development projects than ever before.

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